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TC1072/TC1073
50mA and 100mA CMOS LDOs with Shutdown, ERROR Output and VREF Bypass
Features:
* 50 A Ground Current for Longer Battery Life * Very Low Dropout Voltage * Choice of 50 mA (TC1072) and 100 mA (TC1073) Output * High Output Voltage Accuracy * Standard or Custom Output Voltages * Power-Saving Shutdown Mode * ERROR Output Can Be Used as a Low Battery Detector or Processor Reset Generator * Bypass Input for Ultra Quiet Operation * Overcurrent and Overtemperature Protection * Space-Saving 6-Pin SOT-23 Package * Pin Compatible Upgrades for Bipolar Regulators * Standard Output Voltage Options: - 1.8V, 2.5V, 2.6V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V * Other output voltages are available. Please contact Microchip Technology Inc. for details.
General Description
The TC1072 and TC1073 are high accuracy (typically 0.5%) CMOS upgrades for older (bipolar) low dropout regulators. Designed specifically for battery-operated systems, the devices' CMOS construction eliminates wasted ground current, significantly extending battery life. Total supply current is typically 50 A at full load (20 to 60 times lower than in bipolar regulators). The devices' key features include ultra low noise operation (plus optional Bypass input); very low dropout voltage (typically 85 mV, TC1072 and 180 mV, TC1073 at full load) and fast response to step changes in load. An error output (ERROR) is asserted when the devices are out-of-regulation (due to a low input voltage or excessive output current). ERROR can be used as a low battery warning or as a processor RESET signal (with the addition of an external RC network). Supply current is reduced to 0.5 A (max) and both VOUT and ERROR are disabled when the shutdown input is low. The devices incorporate both overtemperature and overcurrent protection. The TC1072 and TC1073 are stable with an output capacitor of only 1 F and have a maximum output current of 50 mA, and 100 mA, respectively. For higher output current versions, please see the TC1185, TC1186, TC1187 (IOUT = 150 mA) and TC1107, TC1108 and TC1173 (IOUT = 300 mA) data sheets.
Applications:
* * * * * * * Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators for SMPS Pagers
Package Type
6-Pin SOT-23
VOUT Bypass ERROR 6 5 4
Typical Application Circuit
RP
VIN
1
VIN
VOUT
6 + 1 F
VOUT
TC1072 TC1073
2 GND Bypass 5
CBYPASS 470 pF
1 VIN
2 GND
3 SHDN
3 SHDN ERROR
4
ERROR
Shutdown Control (from Power Control Logic)
(c) 2007 Microchip Technology Inc.
DS21354D-page 1
TC1072/TC1073
1.0 ELECTRICAL CHARACTERISTICS
Note: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings
Input Voltage .........................................................6.5V Output Voltage........................... (-0.3V) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 6) Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V Operating Temperature Range...... -40C < TJ < 125C Storage Temperature..........................-65C to +150C
TC1072/TC1073 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise noted, VIN = VOUT + 1V, IL = 0.1 mA, CL = 3.3 F, SHDN > VIH, TA = +25C. Boldface type specifications apply for junction temperatures of -40C to +125C. Symbol VIN IOUTMAX VOUT TCVOUT VOUT/VIN VOUT/VOUT VIN-VOUT Parameter Input Operating Voltage Maximum Output Current Output Voltage VOUT Temperature Coefficient Line Regulation Load Regulation Dropout Voltage Min 2.7 50 100 VR - 2.5% -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Typ -- -- -- Max 6.0 -- -- Units V mA mA V ppm/C % % mV Test Conditions Note 9 TC1072 TC1073 Note 1 Note 2 (VR + 1V) VIN 6V IL = 0.1 mA to IOUTMAX (Note 3) IL = 0.1 mA IL = 20 mA IL = 50 mA IL = 100 mA (Note 4), TC1073 SHDN = VIH, IL = 0 (Note 8) SHDN = 0V FRE 1 kHz VOUT = 0V Notes 5, 6
VR 0.5% VR + 2.5% 20 40 0.05 0.5 2 65 85 180 50 0.05 64 300 0.04 160 10 260 -- -- 0.35 2.0 -- -- 120 250 80 0.5 -- 450 -- -- -- --
IIN IINSD PSRR IOUTSC VOUT/PD TSD TSD eN
Note 1: 2: 3: 4: 5: 6: 7: 8: 9:
Supply Current Shutdown Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Thermal Shutdown Die Temperature Thermal Shutdown Hysteresis Output Noise
A A dB mA V/W C C nV/Hz
IL = IOUTMAX 470 pF from Bypass to GND
VR is the regulator output voltage setting. For example: VR = 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V. TC VOUT = (VOUTMAX - VOUTMIN) x 106 VOUT x T Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 "Thermal Considerations" for more details. Hysteresis voltage is referenced by VR. Apply for Junction Temperatures of -40C to +85C. The minimum VIN has to justify the conditions = VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX.
DS21354D-page 2
(c) 2007 Microchip Technology Inc.
TC1072/TC1073
TC1072/TC1073 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: Unless otherwise noted, VIN = VOUT + 1V, IL = 0.1 mA, CL = 3.3 F, SHDN > VIH, TA = +25C. Boldface type specifications apply for junction temperatures of -40C to +125C. Symbol SHDN Input VIH VIL VINMIN VOL VTH VHYS tDELAY
Note 1: 2: 3: 4: 5: 6: 7: 8: 9:
Parameter
Min
Typ
Max
Units
Test Conditions
SHDN Input High Threshold SHDN Input Low Threshold Minimum VIN Operating Voltage Output Logic Low Voltage ERROR Threshold Voltage ERROR Positive Hysteresis VOUT to ERROR Delay
45 -- 1.0 -- -- -- --
-- -- -- -- 0.95 x VR 50 2.5
-- 15 -- 400 -- -- --
%VIN %VIN V mV V mV ms
VIN = 2.5V to 6.5V VIN = 2.5V to 6.5V
ERROR Open Drain Output 1 mA Flows to ERROR See Figure 4-2 Note 7 Vout falling from VR to VR-10%
VR is the regulator output voltage setting. For example: VR = 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V. TC VOUT = (VOUTMAX - VOUTMIN) x 106 VOUT x T Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 "Thermal Considerations" for more details. Hysteresis voltage is referenced by VR. Apply for Junction Temperatures of -40C to +85C. The minimum VIN has to justify the conditions = VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX.
(c) 2007 Microchip Technology Inc.
DS21354D-page 3
TC1072/TC1073
2.0
Note:
TYPICAL CHARACTERISTICS CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise specified, all parts are measured at temperature = +25C.
Dropout Voltage vs. Temperature (VOUT = 3.3V) Dropout Voltage vs. Temperature (VOUT = 3.3V) ILOAD = 50mA
0.020 0.018
0.100
ILOAD = 10mA
DROPOUT VOLTAGE (V)
DROPOUT VOLTAGE (V)
0.090 0.080 0.070 0.060 0.050 0.040 0.030 0.020 0.010
0 20 50 TEMPERATURE (C) 70 125
0.016 0.014 0.012 0.010 0.008 0.006 0.004 0.002 0.000 -40 -20
CIN = 1F COUT = 1F
CIN = 1F COUT = 1F
0.000 -40 -20 0 20 50 TEMPERATURE (C) 70 125
0.200 0.180 DROPOUT VOLTAGE (V) 0.160 0.140 0.120 0.100 0.080 0.060 0.040 0.020 0.000
Dropout Voltage vs. Temperature (VOUT = 3.3V) ILOAD = 100mA
DROPOUT VOLTAGE (V)
0.300 0.250 0.200 0.150 0.100 0.050 0.000 -40 -20 0 20 50 70 125
Dropout Voltage vs. Temperature (VOUT = 3.3V) ILOAD = 150mA
CIN = 1F COUT = 1F
CIN = 1F COUT = 1F
-40 -20 0 20 50 TEMPERATURE (C) 70 125
TEMPERATURE (C)
90 80
Ground Current vs. VIN (VOUT = 3.3V) ILOAD = 10mA
90 80
Ground Current vs. VIN (VOUT = 3.3V) ILOAD = 100mA
GND CURRENT (A)
60 50 40 30 20 10 0
GND CURRENT (A)
CIN = 1F COUT = 1F
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 VIN (V)
70
70 60 50 40 30 20 10 0
CIN = 1F COUT = 1F
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5
VIN (V)
DS21354D-page 4
(c) 2007 Microchip Technology Inc.
TC1072/TC1073
Note: Unless otherwise specified, all parts are measured at temperature = +25C.
80 70
GND CURRENT (A)
Ground Current vs. VIN (VOUT = 3.3V) ILOAD = 150mA
3.5
VOUT vs. VIN (VOUT = 3.3V) ILOAD = 0
3 2.5
60 VOUT (V) CIN = 1F COUT = 1F
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 7.5 VIN (V)
50 40 30 20 10 0
2 1.5 1 0.5 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7
CIN = 1F COUT = 1F
VIN (V)
3.5 3.0 2.5
VOUT (V)
VOUT vs. VIN (VOUT = 3.3V)
3.320
Output Voltage vs. Temperature (VOUT = 3.3V) ILOAD = 10mA
ILOAD = 100mA
3.315 3.310 3.305
2.0 1.5 1.0 0.5 0.0
0
VOUT (V)
3.300 3.295 3.290 3.285
CIN = 1F COUT = 1F
0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 6.5 7 VIN (V)
3.280 3.275 -40
CIN = 1F COUT = 1F VIN = 4.3V
-20 -10 0 20 40 85 125
TEMPERATURE (C)
3.290 3.288 3.286
Output Voltage vs. Temperature (VOUT = 3.3V) ILOAD = 150mA
VOUT (V)
3.284 3.282 3.280 3.278 3.276 3.274 -40 -20 -10 0 20 40 85 125
CIN = 1F COUT = 1F VIN = 4.3V
TEMPERATURE (C)
(c) 2007 Microchip Technology Inc.
DS21354D-page 5
TC1072/TC1073
Note: Unless otherwise specified, all parts are measured at temperature = +25C.
5.025 5.020 5.015
Output Voltage vs. Temperature (VOUT = 5V) ILOAD = 10mA
4.994 4.992 4.990 4.988
Output Voltage vs. Temperature (VOUT = 5V) ILOAD = 150mA
VOUT (V)
5.005 5.000 4.995 4.990 4.985
VOUT (V) VIN = 6V CIN = 1F COUT = 1F
-40 -20 -10 0 20 40 85 125
5.010
4.986 4.984 4.982 4.980 4.978 4.976 4.974 -40 -20 -10 0 20 40 85 125
VIN = 6V CIN = 1F COUT = 1F
TEMPERATURE (C)
TEMPERATURE (C)
70 60
Temperature vs. Quiescent Current (VOUT = 5V) ILOAD = 10mA
GND CURRENT (A)
80 70 60 50 40 30 20 10 0
Temperature vs. Quiescent Current (VOUT = 5V)
ILOAD = 150mA
GND CURRENT (A)
50 40 30 20 10 0 -40 -20 -10 0 20 40 TEMPERATURE (C) 85 125
VIN = 6V CIN = 1F COUT = 1F
VIN = 6V CIN = 1F COUT = 1F
-40
-20
-10
0
20
40
85
125
TEMPERATURE (C)
Output Noise vs. Frequency 10.0 1000 RLOAD = 50 COUT = 1F CIN = 1F CBYP = 0 COUT ESR ()
Stability Region vs. Load Current COUT = 1F to 10F -30 -35 -40 100 10 1 Stable Region PSRR (dB) -45 -50 -55 -60 -65 0.1 -70 -75
Power Supply Rejection Ratio IOUT = 10mA VINDC = 4V VINAC = 100mVp-p VOUT = 3V CIN = 0 COUT = 1F
NOISE (V/Hz)
1.0
0.1
0.0 0.01K 0.1K
0.01 1K 10K 100K 1000K FREQUENCY (Hz) 0 10 20 30 40 50 60 70 80 90 100 LOAD CURRENT (mA)
-80 0.01K 0.1K
1K 10K 100K 1000K FREQUENCY (Hz)
DS21354D-page 6
(c) 2007 Microchip Technology Inc.
TC1072/TC1073
Note: Unless otherwise specified, all parts are measured at temperature = +25C.
Measure Rise Time of 3.3V LDO with Bypass Capacitor Measure Rise Time of 3.3V LDO without Bypass Capacitor Conditions: CIN = 1F, COUT = 1F, CBYP = 470pF, ILOAD = 100mA VIN = 4.3V, Temp = 25C, Rise Time = 448S Conditions: CIN = 1F, COUT = 1F, CBYP = 0pF, ILOAD = 100mA VIN = 4.3V, Temp = 25C, Rise Time = 184S
VSHDN
VSHDN
VOUT
VOUT
Measure Fall Time of 3.3V LDO with Bypass Capacitor Conditions: CIN = 1F, COUT = 1F, CBYP = 470pF, ILOAD = 50mA VIN = 4.3V, Temp = 25C, Fall Time = 100S
Measure Fall Time of 3.3V LDO without Bypass Capacitor Conditions: CIN = 1F, COUT = 1F, CBYP = 0pF, ILOAD = 100mA VIN = 4.3V, Temp = 25C, Fall Time = 52S
VSHDN
VSHDN
VOUT
VOUT
(c) 2007 Microchip Technology Inc.
DS21354D-page 7
TC1072/TC1073
Note: Unless otherwise specified, all parts are measured at temperature = +25C.
Measure Rise Time of 5.0V LDO with Bypass Capacitor Conditions: CIN = 1F, COUT = 1F, CBYP = 470pF, ILOAD = 100mA VIN = 6V, Temp = 25C, Rise Time = 390S
Measure Rise Time of 5.0V LDO without Bypass Capacitor Conditions: CIN = 1F, COUT = 1F, CBYP = 0pF, ILOAD = 100mA VIN = 6V, Temp = 25C, Rise Time = 192S
VSHDN
VSHDN
VOUT
VOUT
Measure Fall Time of 5.0V LDO with Bypass Capacitor Conditions: CIN = 1F, COUT = 1F, CBYP = 470pF, ILOAD = 50mA VIN = 6V, Temp = 25C, Fall Time = 167S
Measure Fall Time of 5.0V LDO without Bypass Capacitor Conditions: CIN = 1F, COUT = 1F, CBYP = 0pF, ILOAD = 100mA VIN = 6V, Temp = 25C, Fall Time = 88S
VSHDN
VSHDN
VOUT
VOUT
DS21354D-page 8
(c) 2007 Microchip Technology Inc.
TC1072/TC1073
Note: Unless otherwise specified, all parts are measured at temperature = +25C.
Load Regulation of 3.3V LDO Conditions: CIN = 1F, COUT = 2.2F, CBYP = 470pF, VIN = VOUT + 0.25V, Temp = 25C
Load Regulation of 3.3V LDO Conditions: CIN = 1F, COUT = 2.2F, CBYP = 470pF, VIN = VOUT + 0.25V, Temp = 25C
ILOAD = 50mA switched in at 10kHz, VOUT is AC coupled
ILOAD = 100mA switched in at 10kHz, VOUT is AC coupled
ILOAD
ILOAD
VOUT
VOUT
Load Regulation of 3.3V LDO Conditions: CIN = 1F, COUT = 2.2F, CBYP = 470pF, VIN = VOUT + 0.25V, Temp = 25C
Line Regulation of 3.3V LDO Conditions: VIN = 4V, + 1V Squarewave @ 2.5kHz
ILOAD = 150mA switched in at 10kHz, VOUT is AC coupled
ILOAD
VIN
VOUT
VOUT
CIN = 0F, COUT = 1F, CBYP = 470pF, ILOAD = 100mA, VIN & VOUT are AC coupled
(c) 2007 Microchip Technology Inc.
DS21354D-page 9
TC1072/TC1073
Note: Unless otherwise specified, all parts are measured at temperature = +25C.
Line Regulation of 5.0V LDO Conditions: VIN = 6V, + 1V Squarewave @ 2.5kHz
Thermal Shutdown Response of 5.0V LDO Conditions: VIN = 6V, CIN = 0F, COUT = 1F
VIN
VOUT
VOUT
CIN = 0F, COUT = 1F, CBYP = 470pF, ILOAD = 100mA, VIN & VOUT are AC coupled
ILOAD was increased until temperature of die reached about 160C, at which time integrated thermal protection circuitry shuts the regulator off when die temperature exceeds approximately 160C. The regulator remains off until die temperature drops to approximately 150C.
DS21354D-page 10
(c) 2007 Microchip Technology Inc.
TC1072/TC1073
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin No. (6-Pin SOT-23) 1 2 3 4 5 6
PIN FUNCTION TABLE
Symbol VIN GND SHDN ERROR Bypass VOUT Unregulated supply input. Ground terminal. Shutdown control input. Out-of-Regulation Flag. (Open drain output). Reference bypass input. Regulated voltage output. Description
3.1
Input Voltage Supply (VIN)
3.4
Out-Of-Regulation Flag (ERROR)
Connect unregulated input supply to the VIN pin. If there is a large distance between the input supply and the LDO regulator, some input capacitance is necessary for proper operation. A 1 F capacitor connected from VIN to ground is recommended for most applications.
ERROR goes low when VOUT is out-of-tolerance by approximately - 5%.
3.5
Reference Bypass Input (Bypass)
Connecting a 470 pF to this input further reduces output noise.
3.2
Ground (GND)
Connect the unregulated input supply ground return to GND. Also connect the negative side of the 1 F typical input decoupling capacitor close to GND and the negative side of the output capacitor COUT to GND.
3.6
Regulated Voltage Output (VOUT)
Connect the output load to VOUT of the LDO. Also connect the positive side of the LDO output capacitor as close as possible to the VOUT pin.
3.3
Shutdown Control Input (SHDN)
The regulator is fully enabled when a logic-high is applied to SHDN. The regulator enters shutdown when a logic-low is applied to SHDN. During shutdown, output voltage falls to zero, ERROR is open-circuited and supply current is reduced to 0.5 A (maximum).
(c) 2007 Microchip Technology Inc.
DS21354D-page 11
TC1072/TC1073
4.0 DETAILED DESCRIPTION
VOUT VTH tDELAY HYSTERESIS (VH)
The TC1072 and TC1073 are precision fixed output voltage regulators. (If an adjustable version is desired, please see the TC1070/TC1071/TC1187 data sheet.) Unlike bipolar regulators, the TC1072 and TC1073's supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0 mA to IOUTMAX load current range, (an important consideration in RTC and CMOS RAM battery back-up applications). Figure 4-1 shows a typical application circuit. The regulator is enabled any time the shutdown input (SHDN) is at or above VIH, and shutdown (disabled) when SHDN is at or below VIL. SHDN may be controlled by a CMOS logic gate, or I/O port of a microcontroller. If the SHDN input is not required, it should be connected directly to the input supply. While in shutdown, supply current decreases to 0.05 A (typical), VOUT falls to zero volts, and ERROR is opencircuited.
VIN 1 F VOUT VOUT + 1 F C1
ERROR VIH VOL
FIGURE 4-2:
Error Output Operation.
4.2
Output Capacitor
+ + Battery
TC1072 TC1073
GND Bypass
C3, 470 pF
V+ SHDN Shutdown Control (to CMOS Logic or Tie to VIN if unused) ERROR R1 1M BATTLOW or RESET 0.2 F C2
C2 Required Only if ERROR is used as a Processor RESET Signal (See Text)
A 1 F (minimum) capacitor from VOUT to ground is recommended. The output capacitor should have an effective series resistance greater than 0.1 and less than 5.0, and a resonant frequency above 1 MHz. A 1 F capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30C, solid tantalums are recommended for applications operating below -25C.) When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques.
4.3
Bypass Input
FIGURE 4-1:
Typical Application Circuit.
4.1
ERROR Open-Drain Output
ERROR is driven low whenever VOUT falls out of regulation by more than -5% (typical). This condition may be caused by low input voltage, output current limiting, or thermal limiting. The ERROR output voltage value (e.g. ERROR = VOL at 4.75V (typical) for a 5.0V regulator and 2.85V (typical) for a 3.0V regulator). ERROR output operation is shown in Figure 4-2. Note that ERROR is active tDELAY (typically, 2.5 s) after VOUT falls to VTH, and inactive when VOUT rises above VTH by VHYS. As shown in Figure 4-1, ERROR can be used as a battery low flag, or as a processor RESET signal (with the addition of timing capacitor C2). R1 x C2 should be chosen to maintain ERROR below VIH of the processor RESET input for at least 200 ms to allow time for the system to stabilize. Pull-up resistor R1 can be tied to VOUT, VIN or any other voltage less than (VIN + 0.3V).
A 470 pF capacitor connected from the Bypass input to ground reduces noise present on the internal reference, which in turn significantly reduces output noise. If output noise is not a concern, this input may be left unconnected. Larger capacitor values may be used, but results in a longer time period to rated output voltage when power is initially applied.
DS21354D-page 12
(c) 2007 Microchip Technology Inc.
TC1072/TC1073
5.0
5.1
THERMAL CONSIDERATIONS
Thermal Shutdown
Equation 5-1 can be used in conjunction with Equation 5-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX VOUTMIN ILOADMAX TJMAX TAMAX Find: = 3.0V 5% = 2.7V - 2.5% = 40 mA = 125C = 55C
Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 160C. The regulator remains off until the die temperature drops to approximately 150C.
5.2
Power Dissipation
The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst-case actual power dissipation:
1. Actual power dissipation 2. Maximum allowable dissipation
Actual power dissipation: PD (VINMAX - VOUTMIN)ILOADMAX = [(3.0 x 1.05) - (2.7 x 0.975)] x 40 x 10-3 = 20.7 mW Maximum allowable power dissipation: PDMAX = (TJMAX - TAMAX)
EQUATION 5-1:
PD (VINMAX - VOUTMIN)ILOADMAX Where: PD VINMAX VOUTMIN ILOADMAX = Worst-case actual power dissipation = Maximum voltage on VIN = Minimum regulator output voltage = Maximum output (load) current
JA
= (125 - 55) 220 = 318 mW In this example, the TC1072 dissipates a maximum of 20.7 mW; below the allowable limit of 318 mW. In a similar manner, Equation 5-1 and Equation 5-2 can be used to calculate maximum current and/or input voltage limits.
The maximum allowable power dissipation (Equation 5-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (JA). The 6-Pin SOT-23 package has a JA of approximately 220C/Watt.
EQUATION 5-2:
PDMAX = (TJMAX - TAMAX)
5.3
JA
Layout Considerations
where all terms are previously defined.
The primary path of heat conduction out of the package is via the package leads. Therefore, layouts having a ground plane, wide traces at the pads, and wide power supply bus lines combine to lower JA and therefore increase the maximum allowable power dissipation limit.
(c) 2007 Microchip Technology Inc.
DS21354D-page 13
TC1072/TC1073
6.0
6.1
PACKAGING INFORMATION
1
&
2
Package Marking Information
= part number code + threshold voltage (two-digit code) TC1072 Code EY E1 ET E2 EZ E8 E3 E4 E9 E0 E6 TC1073 Code FY F1 FT F2 FZ F8 F3 F4 F9 F0 F6
(V) 1.8 2.5 2.6 2.7 2.8 2.85 3.0 3.3 3.6 4.0 5.0
3
represents year and quarter code represents production lot ID code
4
6.2
Taping Form
Device Marking
User Direction of Feed
PIN 1
W, Width of Carrier Tape
PIN 1
Standard Reel Component Orientation
P,Pitch Reverse Reel Component Orientation
Carrier Tape, Number of Components per Reel and Reel Size Package 6-Pin SOT-23 Carrier Width (W) 8 mm Pitch (P) 4 mm Part Per Full Reel 3000 Reel Size 7 in
DS21354D-page 14
(c) 2007 Microchip Technology Inc.
TC1072/TC1073
6-Lead Plastic Small Outline Transistor (CH) [SOT-23]
Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging
b
N
4
E E1 PIN 1 ID BY LASER MARK 1 2 e e1 D 3
A
A2
c
A1
L L1
Units Dimension Limits MIN MILLIMETERS NOM 6 0.95 BSC 1.90 BSC 0.90 0.89 0.00 2.20 1.30 2.70 0.10 0.35 0 0.08 - - - - - - - - - - 1.45 1.30 0.15 3.20 1.80 3.10 0.60 0.80 30 0.26 MAX
Number of Pins Pitch Outside Lead Pitch Overall Height Molded Package Thickness Standoff Overall Width Molded Package Width Overall Length Foot Length Footprint Foot Angle Lead Thickness
N e e1 A A2 A1 E E1 D L L1 c
Lead Width b 0.20 - 0.51 Notes: 1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-028B
(c) 2007 Microchip Technology Inc.
DS21354D-page 15
TC1072/TC1073
NOTES:
DS21354D-page 16
(c) 2007 Microchip Technology Inc.
TC1072/TC1073
APPENDIX A: REVISION HISTORY
Revision D (February 2007)
Page 1: Ground current changed to 50 A. Package type changed from SOT-23A to SOT-23. Added voltage options. TDELAY added to Table 1-1. Section 3.0 "Pin Descriptions": Added pin descriptions. * Section 4.1 "ERROR Open-Drain Output": Defined tDELAY. * Changed Figure 4-2. * Updated Packaging Information. * * * * *
Revision C (January 2006)
* Undocumented changes.
Revision B (May 2002)
* Undocumented changes.
Revision A (March 2002)
* Original Release of this Document.
(c) 2007 Microchip Technology Inc.
DS21354D-page 17
TC1072/TC1073
NOTES:
DS21354D-page 18
(c) 2007 Microchip Technology Inc.
TC1072/TC1073
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device -- X.X X XXXXX Package Examples:
a) b) c) d) e) f) g) h) i) j) k) a) b) c) d) e) f) g) h) i) j) k) TC1072-1.8VCH713: TC1072-2.5VCH713 TC1072-2.6VCH713 TC1072-2.7VCH713 TC1072-2.8VCH713 TC1072-2.85VCH713 TC1072-3.0VCH713 TC1072-3.3VCH713 TC1072-3.6VCH713 TC1072-4.0VCH713 TC1072-5.0VCH713 TC1073-1.8VCH713: TC1073-2.5VCH713 TC1073-2.6VCH713 TC1073-2.7VCH713 TC1073-2.8VCH713 TC1073-2.85VCH713 TC1073-3.0VCH713 TC1073-3.3VCH713 TC1073-3.6VCH713 TC1073-4.0VCH713 TC1073-5.0VCH713 1.8V 2.5V 2.6V 2.7V 2.8V 2.85V 3.0V 3.3V 3.6V 4.0V 5.0V 1.8V 2.5V 2.6V 2.7V 2.8V 2.85V 3.0V 3.3V 3.6V 4.0V 5.0V
Threshold Temperature Voltage Range
Device
TC1072: CMOS LDO with Shutdown, ERROR Output & VREF Bypass TC1073: CMOS LDO with Shutdown, ERROR Output & VREF Bypass 1.8 2.5 2.6 2.7 2.8 2.85 3.0 3.3 3.6 4.0 5.0 = = = = = = = = = = = 1.8V 2.5V 2.6V 2.7V 2.8V 2.85V 3.0V 3.3V 3.6V 4.0V 5.0V
Threshold voltage (typical)
Temperature Range Package
V
= -40 C to +125 C Plastic small outline transistor (CH) SOT-23, 6 lead, (tape and reel).
CH713 =
(c) 2007 Microchip Technology Inc.
DS21354D-page 19
TC1072/TC1073
NOTES:
DS21354D-page 20
(c) 2007 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices: * * * Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable."
* *
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
Trademarks The Microchip name and logo, the Microchip logo, Accuron, dsPIC, KEELOQ, KEELOQ logo, microID, MPLAB, PIC, PICmicro, PICSTART, PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AmpLab, FilterLab, Linear Active Thermistor, Migratable Memory, MXDEV, MXLAB, PS logo, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance, UNI/O, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. (c) 2007, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona, Gresham, Oregon and Mountain View, California. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
(c) 2007 Microchip Technology Inc.
DS21354D-page 21
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://support.microchip.com Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260 Kokomo Kokomo, IN Tel: 765-864-8360 Fax: 765-864-8387 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Santa Clara Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445 Toronto Mississauga, Ontario, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Habour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8528-2100 Fax: 86-10-8528-2104 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 China - Fuzhou Tel: 86-591-8750-3506 Fax: 86-591-8750-3521 China - Hong Kong SAR Tel: 852-2401-1200 Fax: 852-2401-3431 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 China - Shenzhen Tel: 86-755-8203-2660 Fax: 86-755-8203-1760 China - Shunde Tel: 86-757-2839-5507 Fax: 86-757-2839-5571 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 China - Xian Tel: 86-29-8833-7250 Fax: 86-29-8833-7256
ASIA/PACIFIC
India - Bangalore Tel: 91-80-4182-8400 Fax: 91-80-4182-8422 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 India - Pune Tel: 91-20-2566-1512 Fax: 91-20-2566-1513 Japan - Yokohama Tel: 81-45-471- 6166 Fax: 81-45-471-6122 Korea - Gumi Tel: 82-54-473-4301 Fax: 82-54-473-4302 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 Malaysia - Penang Tel: 60-4-646-8870 Fax: 60-4-646-5086 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 Taiwan - Hsin Chu Tel: 886-3-572-9526 Fax: 886-3-572-6459 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350
EUROPE
Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 UK - Wokingham Tel: 44-118-921-5869 Fax: 44-118-921-5820
12/08/06
DS21354D-page 22
(c) 2007 Microchip Technology Inc.

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